Kraft Paper for CCL – Stable Structure & Layer Adhesion
Kraft paper for CCL plays a key role in the multilayer structure of copper-clad laminates. Serving as the CCL substrate or reinforcement layer, it ensures structural stability through careful raw material selection, precise papermaking control, and resin impregnation for reinforcement. Compared with ordinary or recycled kraft paper, pure wood pulp kraft paper offers superior fiber quality and structural stability, bringing benefits such as accurate lamination, better processing tolerance, and long-term reliability for CCL.
CCL Kraft Paper: Core Role – Stability & Layer Adhesion
What is CCL and its layered structure?
CCL (Copper Clad Laminate) is a PCB raw material made by bonding copper foil to an insulating substrate with adhesive. Its core layered structure (from surface to core) is: copper foil → adhesive → kraft paper substrate/reinforcement layer → adhesive → copper foil. In multilayer CCL, 1–5 layers of kraft paper can be stacked. This layered structure requires tight adhesion and zero deformation; otherwise, PCB traces may misalign. Kraft paper, as the core or reinforcement layer, plays a critical role in structural stability.
Core role of kraft paper in CCL: the structural backbone
In CCL, kraft paper mainly serves as the core substrate or reinforcement layer, providing three key benefits:
- Structural support: Offers a rigid backbone to prevent warping or deformation after lamination.
- Even pressure distribution: Spreads pressure during lamination to ensure tight adhesion between copper foil and adhesive, minimizing air bubbles.
- Insulation enhancement: Works with adhesive to improve overall insulation, preventing interlayer leakage.
The 3 Core Benefits: Stability & Strong Layer Adhesion

Improve CCL Lamination Precision and Reduce Production Defects
- Kraft paper made from pure wood pulp maintains a thickness tolerance of ≤±1 μm, ensuring uniform layer thickness during lamination. This allows the total CCL thickness tolerance to stay within ±0.03 mm, compared to the industry average of ±0.05 mm.
- Its structural stability prevents local shrinkage during lamination, reducing copper foil and substrate misalignment. As a result, trace alignment precision improves by 20%, lowering the risk of short circuits during PCB etching.
Enhance CCL Processing Tolerance for Complex Operations
- CCL often undergoes drilling, cutting, and etching. A stable kraft paper substrate can:
- Resist tearing during drilling, thanks to tightly interwoven long fibers. Drill walls remain smooth and burr-free, achieving a 99.5% hole quality rate (compared with 97% for standard kraft paper CCL).
- Cut cleanly without delamination or debris, preventing separation of copper foil and substrate, and improving processing efficiency by 15%.
Ensure Long-Term CCL Reliability and Extend PCB Lifespan
- Environmental adaptability: In humidity ranges of 20%-80% RH and temperatures from -40 to 85 °C, pure wood pulp kraft paper CCL retains ≥90% interlayer bonding strength (standard kraft paper CCL ≤75%), preventing delamination over time.
- Stable insulation: Dense structure reduces moisture penetration, keeping CCL insulation resistance above 10¹² Ω long-term, eliminating PCB leakage risks, and extending electronic device lifespan—for example, increasing home appliance PCB lifespan from 8 to 12 years.
Specifications: Grammage Of Boosts CCL Stability
| Specification | Parameter Range | Application Scenario |
|---|---|---|
| Basis Weight | 80 g/㎡, 100 g/㎡, 120 g/㎡, 150 g/㎡ | 80–100 g/㎡: Thin CCL (e.g., consumer electronics PCBs); 120–150 g/㎡: Thick CCL (e.g., industrial control PCBs) |
| Size | Roll: width 1220 mm / 1530 mm, length 500–1000 m; Sheet: 1220×1530 mm / 1020×1220 mm | Roll: suitable for automated CCL production lines; Sheet: for small-batch customized CCL production |
| Color | Natural wood (brown-yellow) | For CCL applications without special appearance needs; natural wood color is free of dyes, preventing impurities that affect insulation performance |
| Other Key Parameters | Tensile strength: ≥3.5 kN/m (MD), ≥2.0 kN/m (CD); Thickness tolerance: ≤±1 μm; Resin uptake: 18–22 g/㎡ | Meets CCL lamination requirements for strength, precision, and resin bonding |
Material Comparison: Boosts CCL Stability & Adhesion
| Comparison Dimension | Pure Wood Pulp CCL Kraft Paper | Regular Kraft Paper (Mixed Pulp) | Recycled Kraft Paper |
|---|---|---|---|
| Fiber Quality | Long conifer fibers (2.8–4.2 mm), purity 99.8%+ | Hardwood short fibers (1.2–2.0 mm) + small amount of softwood pulp | Short fibers (1.0–1.8 mm), with impurities (plastic/ink) |
| Tensile Strength | MD ≥3.5 kN/m, CD ≥2.0 kN/m | MD ≤2.5 kN/m, CD ≤1.5 kN/m | MD ≤2.0 kN/m, CD ≤1.2 kN/m |
| Thickness Tolerance | ≤±1 µm | ±3 µm | ±5 µm |
| Moisture Deformation Rate (24h soak) | ≤0.1% | ≥0.3% | ≥0.5% |
| High-Temperature Shrinkage (150℃ / 1h) | ≤0.05% | ≥0.15% | ≥0.25% |
| CCL Compatibility | Perfect fit, no warping/bubbles | Tends to cause warping, bubble rate 1.2% | Not suitable, CCL defect rate exceeds 5% |
Stability & Adhesion: Controlled in Key Processes
Structural stability is the defining property of kraft paper for CCL, as it directly affects lamination accuracy. This stability is achieved through strict control across three stages—raw material selection, papermaking process, and resin impregnation.
Raw Material Selection: Pure Wood Pulp as the Foundation
- Main Material: 100% conifer pulp (70%+ pine, 30% spruce), with no mixed or recycled pulp.
- Why It Matters: Conifer fibers are 2.8–4.2 mm long—twice that of hardwood pulp—interweaving into a dense, high-purity (ash ≤0.05%) network. This three-dimensional mesh resists breakage and prevents structural looseness.
- Excluded Materials: Hardwood pulp (short fibers prone to deformation) and recycled pulp (impurities and weak fibers) reduce stability and are not used.
Papermaking Process: Precision Control for Dense Structure
By fine-tuning refining, forming, and drying parameters, kraft paper achieves uniform fiber distribution and tight structure:
| Step | Controlled Parameter | Stability Principle | Advantage Over Standard Process |
|---|---|---|---|
| Refining | 28–35°SR (low) | Preserves long fibers with minimal cutting, fewer weak points | Standard 40–50°SR shortens fibers, weakens structure |
| Forming | Long-wire machine, vacuum –0.07 MPa | Even dewatering, uniform fiber layout, thickness tolerance ≤±1 μm | Standard forming ±3 μm, uneven density |
| Drying | 80–110℃ gradient for 20 min | Gentle drying ensures even shrinkage, avoids deformation | Fast 120–140℃ drying causes fiber brittleness |
Resin Impregnation: Reinforcing the Structure
Phenolic resin impregnation (solid content 45–50%) further locks in stability:
- Resin Load: 18–22 g/m² (dry), penetrating fiber pores and forming a rigid resin network.
- Curing Parameters: 130–140℃ for 30 min, ensuring full crosslinking and preventing shrinkage during CCL lamination.
- Core Effect: After impregnation, tensile strength rises by 40% (≥3.5 kN/m), while moisture deformation drops to ≤0.1%, doubling overall structural stability.

